This workshop is designed for students, electronics and VLSI design engineers, packaging specialists, and professionals interested in understanding semiconductor packaging technologies.
A basic understanding of semiconductor design and fabrication is recommended. Familiarity with chip manufacturing processes is helpful but not mandatory.
Yes, participants will receive a certificate upon successful completion of the workshop.
The workshop includes practical training with industry-standard tools like ANSYS Icepak and AEDT (Ansys Electronics Desktop) for thermal simulation and package design.
The workshop blends both theoretical concepts and practical lab sessions to ensure comprehensive learning.
The workshop runs for 1 week and is conducted in an online format, with a combination of lectures and hands-on practical sessions.
This workshop equips you with industry-relevant knowledge, practical skills, and hands-on experience with leading simulation tools, enhancing your employability in semiconductor packaging, design, and system integration fields.
Yes, the workshop will provide opportunities to interact with experienced professionals and industry experts.
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